Today Meizu Mobile officially announced that it will strive to release the Meizu 17 5G flagship mobile phone in April. At the same time, the official also sent out a thank you message for Meizu’s 17th anniversary via Weibo. Meizu was officially established on March 14th, 17 years ago. Furthermore, Meizu expressed its gratitude to friends and partners in the letter. The official also stated in the open letter that Meizu 17th will meet with us in April.
The official spec sheet of the Meizu 17 is still under wraps. However, we have a couple of rumors and speculations regarding this device. We can confirm that this smartphone will come with the Snapdragon 865 + X55 5G chip. Furthermore, there is a good chance that this device will come with Meizu Wi-Fi 6.
Meizu 17 dumps the ring flash design?
Meizu is not really consistent with smartphones. However, its devices seem to be much anticipated before they finally arrive. In recent times, there have been multiple speculations regarding the upcoming Meizu 17. We have also seen a couple of renders of this smartphone. The latest render of this phone shows that the company will not use the “ring flash” design on this one.
In addition, this smartphone comes with a horizontal triple rear camera setup with an LED flash. The rear camera module also uses an “explosion shield” to protect it from adverse conditions. Also on the rear is the “MEIZU Logo”. The back of this phone further reveals that it will be produced in China (obviously) and it supports 5G network.
There is no rear fingerprint sensor on this render. Since it is a flagship, it is most likely that it will come with an on-screen fingerprint sensor. Overall, the rear of this upcoming flagship is very simple.
It is worth noting that the Meizu 17 back design that was exposed this time matches the previously exposed Meizu 17 back shell, both of which have strip-shaped horizontal triple-shot solutions. However, the rear camera module of the device in the rendering of this exposure seems to be a little bigger.