Redmi K50 e-sports version disassembly reveals its full internals


Redmi’s first masterpiece in the new year is the Redmi K50 e-sports version. The first official sale of this device suggests that it will be very popular. The sales report reveals that in just one minute, the Redmi K50 e-sports version achieved omni-channel sales of 280 million ($44.2 million). This device also has a good start award for 2022. Today, Redmi took to its official Weibo handle to reveal the entire internals of this smartphone. The just over a minute disassembly video shows how this device was put together.

Redmi K50 e-sports version

From the official launch event, Redmi claims that this device has one of the best heat dissipation structure in the industry. So, how is the interior work of the Redmi K50 e-sports version? What does the JBL wideband four-unit speaker look like? How did Redmi arrange the CyberEngine ultra-wideband X-axis motor 1016? The video reveals and provides answers to all these questions. To view the video on Weibo, click HERE. If you do not want to watch the video, you can follow the description and images below

Redmi K50 e-sports version disassembly description

After opening the back cover, the layout of the back of the phone can be seen at a glance. After further dismantling, you can see the heat dissipation system composed of graphene heat dissipation film material. We can also see the 3D high-power graphite, large-area double VC, and heat dissipation copper sheet + boron nitride.

Redmi K50 e-sports version

The Redmi K50 e-sports version has 7 major innovations and 5 major new materials for heat dissipation. It has a separation layout of processor heat source and charging heat source. The main heat dissipation material may be the largest in the industry. This device uses a large 4860 square millimeter double VC cooling material.

Read Also:  Redmi Note 11T Pro+ is the first LCD screen with DisplayMate A+ cert.

Redmi K50 e-sports version

Specifically, the main VC is 4015 square millimeters, covering the upper half of the processor and the battery. The hydrophilic capillary mesh uses a special process and the heat dissipation efficiency increases by 10%. times.

The secondary VC is 845 square millimeters, covering two charging IC chips, with a 3D step difference structure. The design of this cooling material fits closely without leaving any gaps. Furthermore, there is a large area of ​​graphene on the front connecting the double VC. On the rear, the 3D high-power graphite improves the thermal conductivity by 15%.

So what is the strength of such a luxurious cooling system in the lineup? Officially, after playing the 120fps “Honor of Kings” for 30 minutes, the body temperature is only 43.5 ℃.

Source/VIA :
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