Chinese analysts have hit Weibo today with breaking news of Huawei’s and Qualcomm’s next generation processors.
Huawei and Qualcomm are both working on new processors for future smartphones, and today details of those chips have been revealed in a Weibo post by well known Chinese industry insider.
According the post, Qualcomm’s Snapdragon 820 is in the works. The SoC, MSM8996 will be built around the latest 14nm manufacturing process. 14nm manufacturing allows for a high performance processor with low-power consumption.
Huawei are also working on a new eight core processor. The Helicon Kirin 950 is rumoured to use 16nm manufacturing and will be the SoC to power the Huawei P8. According to earlier rumours the Huawei P8 will have 4GB RAM and a 2K display.
Yesterday it was revealed in a leaked roadmap that Mediatek would upgrade to 20nm for their next MT67XXX processor to be launched in Q4 of this year.