A recent leak regarding Huawei’s next-gen Kirin 970 SoC gives us some first info on the specs of the chipset and its main architecture. According to it, the upcoming SoC will be built on the 10nm architecture (by TSMC) and will rely on an 8-core Cortex A73 CPU for impressive performance.
According to the leakster, this specific chipset (Kirin 970) is expected to be among the first to pack the ARM Heimdallr MP GPU, and offer 5 carrier aggregation and full network support, along with global frequency compatibility. Its 8-core CPU will be comprised of four ARM Cortex-A73 cores, and four ARM Cortex-A53 cores clocked at a maximum frequency between 2.8-3.0GHz.
It will also offer improvements in vital areas such as power consumption, heat control and others.