It seems there’s some new information on the upcoming flagship chipsets of both Huawei and Qualcomm today, after a specs sheet containing some of the key specifications of the SD 845 and Kirin 970 SoC appeared online.
According to it, both of these two chipsets will be built on the 10nm architecture but… with a twist: Qualcomm’s Snapdragon 845 will use Samsung’s LPE process and Huawei’s Kirin 970 SoC will rely on TSMC’s FinFET technology. If we are to believe what the specs sheet, then the upcoming Snapdragon 845 SoC will pack 4 Cortex-A75 cores and four Cortex-A53 cores and will rely on the Adreno 630 GPU, offering an X20 baseband and 5X20MHz carrier aggregation.
Qualcomm’s next-gen chipser is rumored to ship in the first quarter of 2018 and it will be used in the flagship models of most major manufacturers (Samsung, Sony, Xiaomi, LG).
Huawei’s Kirin 970 SoC however, will be the first to use the ARM Heimdallr MP (Heimdal) GPU, it will rely on ARM Cortex A73 cores and it should be available during the 3rd-4th quarter of this year.