Qualcomm is expected to unveil its new high-end mobile SoC by the end of the year and the latter should provide a nice leap in performance thanks to the 7nm engraving. The AnTuTu benchmark test is already appeared on leaked screenshots.
While Apple and Huawei have already unveiled mobile processors manufactured using the newest 7nm process, respectively with the Apple A12 Bionic and Kirin 980, and while Samsung has announced its 8nm SoC Exynos 9820, it still lacks the Qualcomm call to succeed the Snapdragon 845.
Various information has already begun to circulate and the San Diego group should say more in December at its Snapdragon Tech Summit. The successor of Snapdragon 845 engraved in 10nm should benefit from a 7nm engraving and would be the object of a new name: Snapdragon 8150 rather than a Snapdragon 855.
With the new Soc, we could see for the first time on this platform an NPU module ( Neural Processing Unit ) dedicated to the artificial intelligence rather than a distributed operation between the different elements of the SoC.
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The future SoC for high-end smartphones may have just made an appearance on AnTutu and it already promises very strong performance. The benchmarks shows a score of 362,292 points, while the Snapdragon 845 never crossed the 300,000 points.
It also surpasses the new Huawei SoC Kirin 980 which revolves around 315,000 points, and would compete with the scores of the Apple A12 Bionic (353,210 points).
But that’s not all. The leaked AnTuTu score sheet is coupled with information about core configuration and clock speeds. Supposedly, the leakster who posted the screenshot on Weibo has some inside intel regarding the chipset. He claims that the Snapdragon 8150 comes in an unusual core configuration 1+3+4 or in other words – 1x high-performance core, 3x medium cores and 4x energy-efficient low-performance cores, which contradicts the initial reports. Of course, the information isn’t confirmed and we have to wait to see more details about the next high-end snapdragon Soc.