Today, the 2019 Global Mobile Internet Conference (GMIC) and Science Revival Festival opened in Guangzhou. Huawei president Zhao Ming was invited to attend and delivered a keynote speech entitled ‘The Wind and the Grass’. Zhao Ming revealed much interesting news concerning the Honor Smart Screen. He said it will be equipped with the HiSilicon Hongjun 818 smart chip and lifting AI camera. This new product opened appointment today and will go on sale early August.
In the keynote speech, Zhao Ming said that Honor will launch a new category of smart screens to accelerate the evolution of the traditional TV industry with innovative technologies. He also announced the chip that will be launched on the Honor Smart Screen makes its first public appearance.
Honor Smart Screen Features
HiSilicon has accumulated many years of technology accumulation in the field of display chips. In 2014, they launched the first 4K TV chip. Since then, HiSilicon has been committed to building smart display chips that lead the large screen field. The Hongjun 818 smart chip will provide excellent support for the Honor Smart Screen.
The Hongjun 818 smart chip has the top quality optimization technology. It can bring the ultimate picture quality performance to the Honor Smart Screen. It features a magical image quality engine with dynamic image compensation (MEMC), high dynamic range imaging (HDR), super-segmentation (SR), noise reduction (NR), dynamic contrast enhancement (DCI), and automatic color management (ACM). 7 image quality technologies such as zoning control (LD), picture clarity improvement, contrast, and color performance.
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The computing performance of this chip is quite strong. The multimedia decoding capabilities are powerful as well. Say, it supports 8K@30fps and 4K@120fps super video decoding capabilities. In graphics decoding, this chip supports 64MP image decoding ahead of time, which is beyond the highest resolution that can be captured by the current smartphones. Moreover, it also has a multi-tasking memory access scheduling technology that enables bandwidth utilization to lead the industry by more than 50%. In the multi-task parallel processing, it can always maintain fast response and smooth operation, greatly improving the user experience.
The Hongjun 818 smart chip integrates Histen’s sound quality optimization technology to create a large-screen sound quality experience through sound field expansion, transient distortion correction, dialogue enhancement, loudness adaptation, and intelligent bass. For example, the sound field expansion technology can create a sense of surround sound. The loudness is adaptive. The volume can be automatically adjusted to avoid sudden jumps in the volume when switching programs.
In addition to the Hongjun 818 smart display chip, the Honor Smart Screen will also use the lifting AI camera. As one of the dual centers of smart life in the future, with this camera, it will better connect family members and better play the role of the family emotional center.
This camera is equipped with a special HiSilicon NPU chip with AI capabilities such as face recognition. In addition to the basic functions of taking photos and video calls, the Honor Smart Screen can achieve more innovative experiences. The physical lifting design allows the camera to pop up only when needed.