Meizu is not really consistent with smartphones. However, its devices seem to be much anticipated before they finally arrive. In recent times, there have been multiple speculations regarding the upcoming Meizu 17. We have also seen a couple of renders of this smartphone. The latest render of the Meizu 17 shows that the company will not use the “ring flash” design on this one.
In addition, this smartphone comes with a horizontal triple rear camera setup with an LED flash. The rear camera module also uses an “explosion shield” to protect it from adverse conditions. Also on the rear is the “MEIZU Logo”. The back of this phone further reveals that it will be produced in China (obviously) and it supports 5G network.
There is no rear fingerprint sensor on this render. Since it is a flagship, it is most likely that it will come with an on-screen fingerprint sensor. Overall, the rear of the Meizu 17 is very simple.
It is worth noting that the Meizu 17 back design that was exposed this time matches the previously exposed Meizu 17 back shell, both of which have strip-shaped horizontal triple-shot solutions. However, the rear camera module of the device in the rendering of this exposure seems to be a little bigger.
Meizu 17 will arrive this spring
According to previous reports, this smartphone will support Wi-Fi 6 and it will come with the Snapdragon 865 processor. At the same time, there are reports that this smartphone will arrive this spring. However, there is no specific launch date for now. In all, there is still little information about Meizu 17 and the authenticity of these renders is unknown. We have to keep our fingers crossed while we await some official information regarding this device.
What do you think about this device? Can this smartphone be a major flagship in the market? Let us know your thoughts in the comment section below