Earlier today, Honor confirmed its upcoming smartphone, the Honor 30S to be powered by a new in-house HiSilicon Kirin 820 5G SoC. The brand’s vice president also revealed some key features of the modem fabricated into this chipset.
The Honor 30s first started leaking last week and the brand just announced its launch date yesterday, which is March 30. Now today, the company also reveals it to be the debut device for Huawei’s Kirin 820 5G chipset. This SoC is expected to compete against other mid-range 5G-enabled chips like Qualcomm’s Snapdragon 765G and MediaTek’s Dimensity 1000.
As per the vice president of Honor, who goes by the name of ‘Glory Bear’ on Weibo, the Kirin 820 5G will come with unprecedented 5G features. The 5G modem that comes bundled with the processor will feature ‘industry-leading’ interference suppression tech so that it can maintain a stable and fast connection even in more congested areas. Further, it will be battery-efficient due to the usage of AI intelligent scheduling algorithms. The modem will be also capable of switching over to new base stations quickly to maintain a stable connection. Lastly, it will have support for dual SIM, which will enable 4G VoLTE calls on one SIM and 5G internet connection on another SIM at the same time.
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Furthermore, according to IT Home, the upcoming Kirin 820 5G SoC will be based on Huawei’s own Da Vinci architecture built on 7nm process. It will include Cortex-A76 CPU cores and Mali-G77 GPU for graphics. Lastly, it will feature newer ISP and NPU with support for Kirin Gaming Plus technology.
Anyway, we will know more about the Honor 30S and the Kirin 820 5G chipset in the coming days as we expect the company to tease their features on Weibo.