MediaTek prepares to release a 5G SoC to rival the Snapdragon 875

MediaTek Helio G70

A few days ago, we discussed the first data on the Snapdragon 875 SoC. This information is still one of a kind, so it’s hard to say how reliable it is. Meanwhile, after the announcement of the SoC MediaTek Dimensity 1000+, which is not very clear how it differs from the Dimensity 1000 at all, a MediaTek representative was asked about the company’s future plans.

MediaTek will not leave the Snapdragon 875 without a rival


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In particular, there was a question about rumors regarding the early announcement of the Snapdragon 875. A MediaTek spokesman said the company will be present in this segment of SoC with new products coming out at the appropriate time. That is, MediaTek intends to continue to fight Qualcomm in the segment of the top-end SoCs.

Firstly, we have not heard any rumors regarding the earlier than usual launch of the Snapdragon 875. Secondly, right now MediaTek does not compete with the Snapdragon 865. Because the Dimensity 1000, although it was introduced last year, is not yet present in no smartphone on the market. However, this does not mean that MediaTek will not recover by next year, because for consumers any such competition is for the good.

No doubt, Qualcomm is a leading mobile chip manufacturer and its current flagship SD865 is doing quite well. This chip is one of the most sorted processors for flagship phones as have been its previous flagship chips. The company could release the successor (Qualcomm SD875) to this chip later this year. And it will be Qualcomm’s first 5nm SoC.

A recent leak shows that the Snapdragon 875 uses the codename “SM8350” and will come with the X60 5G modem-RF system. What we do not know is whether Qualcomm will choose to integrate the 5G modem or make it optional. Following current market trends, Qualcomm will most likely follow the embedding route.
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