Huawei HiSilicon recruits talented young people globally


Huawei HiSilicon

Huawei HiSilicon announced the recruitment of talented young people globally. The recruitment targets include the global outstanding masters and graduates who graduated from January 1, 201 to December 31, 2021. The company provides world-class challenging topics, mentors, global vision, platforms and resources, and 5+ times salary.

Many challenging topics involve computer architecture, chips, algorithms, semiconductor technology, material applications, software architecture, and more. The company states:

“We have been looking for talents with a “Core Star” to shine. We’re looking for brave people who are brave to challenge in the new world and want to dive into the new knowledge. Moreover, they will deal with the limits of Moore’s Law, von Neumann’s bottleneck and etc. We hope that our peers will explore the world-class problems that will eventually face. They’ll find methods and paths of computing architecture, and jointly expand the boundaries of civilization and progress.”

Huawei HiSilicon division is behind the development of Kirin chipsets as well as Balong modems for 5G connectivity. While the company develops the technology, it doesn’t necessarily manufacture these chips often relying on TSMC manufacturing powers. However, this tends to change in the face of new restrictions imposed by the U.S. Department of Commerce. It makes perfect sense for the company to look for talented people that will help the company to reinvent themselves and adapt strategies for future demands.

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