MediaTek revolutionized its chipset business last year with the arrival of the Dimensity lineup. The chips in this family came at a low price tag, packing advanced specifications and 5G connectivity. While Qualcomm was making 5G a premium spec, MediaTek and its Dimensity chips came to offer 5G connectivity to the masses. The strategy paid well and MediaTek now sits as the world’s top chipmaker. The company established important partnerships with companies like Xiaomi, Realme, Oppo, Vivo, and even OnePlus. Today, the Taiwanese chipmaker unveiled a new duo of mid-range chips dubbed Dimensity 810 and Dimensity 920 SoCs made on a modern 6 nm architecture. As per a fresh report, the Realme 8s will be the first smartphone to pack the Dimensity 810.
— Madhav Sheth (@MadhavSheth1) August 11, 2021
Shortly after the Dimensity duo announcement, Realme India and Europe’s CEO, Madhav Sheth, retweeted MediaTek’s post about the Dimensity 810 SoC asking if customers and fans will like the phone maker to be the first to bring a Dimensity 810-powered smartphone to the market. This is not a surprise, since Realme has been a strong supporter of Dimensity chips. The company’s Realme GT Neo was also one of the first smartphones to feature the Dimensity 1200 which currently sits as MediaTek’s top offering.
Realme 8s alleged specifications
Unfortunately, Realme’s executive didn’t disclose any details about Realme’s Dimensity 810-powered smartphone. However, it seems to be the Realme 8s smartphone that leaked last month. According to the leaked info, the device will come with a 6.5-inch 90 Hz screen. Unfortunately, it’s not clear if it will be an AMOLED or an LCD screen. However, we’re expecting the latter since the Realme 8 is usually a mid-range lineup and only the Pro versions tend to have an AMOLED screen. The resolution probably is a Full HD+ one. The device will likely have a punch-hole cutout in the top-left part just like all other Realme smartphones in the market.
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We already saw a render revealing the Realme 8s back design. The device has a rectangular camera island with a flash and three camera units inside. The primary camera is a 64 MP snapper. The other two probably are ultrawide and macro/depth sensors. For selfies and video calls, the device will count with a 16 MP snapper.
Other specifications include a 5,000 mAh battery with 33W fast charging. This charging speed basically confirms the phone’s nature as a budget device, since most of the premium mid-ranges from the company are offering 50W or 65W fast-charging. Moving on, the device runs Android 11 with Realme UI 2.0 straight out of the box. It will have 6 GB of RAM and 8 GB of RAM variants. It will also include the virtual RAM expanse feature for an extra 5GB of RAM, we presume. For storage, it will come with 128 GB and 256 GB options. Moreover, the device will come with a side-mounted fingerprint scanner, 3.5mm headphone jack, and a USB-C port.
For those that have missed the Dimensity 810 launch, the new chip is based on the 6nm architecture. It comes with a dual 5G stand-by. It comes with Cortex-A76 cores clocked at up to 2.4 GHz and Cortex-A55 cores of unconfirmed speed. The GPU is an old Mali-G57 MC2 GPU. The Platform offers support for LPDDR4X RAM and UFS 2.2 storage.
Realme has a big global event scheduled for August 18th
Worth noting that Realme will be running an event on August 18. The company will unveil the global versions of Realme GT Master series smartphones, Realme Book, Realme Pad, and other unspecified products.