Vivo X Fold S foldable smartphone exposed with Snapdragon 8+ Gen 1 SoC


Vivo X Fold S

A couple of brands are currently working on new-generation foldable smartphones. We have the Samsung Galaxy Z Fold 4, Galaxy Flip 4 and Xiaomi MIX Fold 2 all due to arrive this month. While the Samsung Galaxy Z Fold 4 is set to launch on August 10th, there is no official launch date for the Xiaomi MIX Fold 2. Now, there are reports that a new foldable smartphone from Vivo is also coming. According to popular Weibo tech blogger @DCS, Vivo’s second dual-screen ultrasonic fingerprint foldable smartphone is already on the way. This device will come with a side physical fingerprint solution. In addition, the upcoming foldable smartphone from Vivo will be called the Vivo X Fold S.

Vivo X Fold S foldable smartphone

This is quite a complex name with two standalone letters. Furthermore, this new device will use a Qualcomm Snapdragon 8+ Gen 1 chip. Of course, the upgrade in this device is not a simple change of chip. In addition, according to previous reports, Vivo will also launch a vertical folding smartphone.

Vivo X Fold foldable smartphone

In April of this year, the Vivo X Fold foldable smartphone was released. This device comes with dual internal and external 120Hz E5 screens. This device also uses a Qualcomm Snapdragon 8 Gen 1 flagship chip, and adopts the original design of “square and sky”. It also comes with aerospace-grade floating wing hinges as well as dual-screen fingerprints.

Vivo X Fold S

The internal screen of Vivo X Fold is an 8.03-inch super-sensing folding giant screen, with E5 luminous material. The display uses Samsung’s diamond arrangement and supports 2K + resolution and a 120Hz refresh rate. This device also supports a superconducting anti-reflective coating with self-developed LTPO-based adaptive refresh for debugging.

Read Also:  Vivo X Fold+ 5G officially teased to get a new hinge mechanism

At the same time, Vivo X Fold has the world’s first internal and external dual 120Hz E5 screen. This device has a large sound cavity three-dimensional symmetrical dual-raiser and an independent Hi-Fi chip. 

Source/VIA :
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