Xiaomi has announced a few days ago that it will present the Mi 9 smartphone in China on February 20 and yesterday we learned that the international presentation will take place in Barcelona on February 24, a day before MWC 2019 starts.
One of the co-founders of Xiaomi has shared yesterday some images of the device in which we could see its back, which, in the words of the manager, “will have a holographic technology of nano-laser engraving and a double nano-coating to create a unique color”.
Gizchina News of the week
Today, we have seen new images that partially show the front of the device. In them we can see that the new Xiaomi Mi 9 will have a very thin “chin”, something that we do not always find in Android smartphones.
In fact, it seems that the chin of the Mi 9 will have a thickness of only 3.6 mm, which is 40 percent less than the Mi 8.
Other specifications that we will see are the Snapdragon 855 processor, memory / storage options from 6GB / 128GB, triple rear camera with 48MP main camera and fast battery charge of 27W.
It is also believed that there will be a special version with 12GB of RAM and a transparent back cover.