Every year Huawei releases a new high-end Kirin chipset to power the newest Mate devices. Speculations have been indicating that the company would unveil its latest Kirin 990 during IFA 2019. Now, thanks to a teaser shared by the company itself, we know that the next-gen Kirin is coming on September 6.
The Chinese Behemoth revealed a short video which details the SoC will come with 5G capabilities. According to rumors, the modem will be built-in in the chipset. So every new Huawei or Honor flagship coming with Kirin 990 will feature 5G straight out the box.
Moreover, the new chipset will be built on TSMC’s 7nm EUV process. Thus, providing 20% greater transistor density and in turn, increased power efficiency. Furthermore, this new chipset should allow 4K recording at 60FPS – It’ll be a first in the Kirin series. Of course, the Kirin 990 will also represent an upgrade in terms of Huawei’s AI interface with a brand new NPU based on Huawei’s Da Vinci architecture. Last, but not least, the new SoC will come with ARM’s latest CPU and GPU components.
If we judge by the past years, then, the Kirin 990 will debut within the newest Huawei Mate 30 devices. In addition, it is expected to power the next Huawei P flagships, as well as premium Honor devices.