Samsung will use Dimensity 9000 – the only brand to use three different platforms


Dimensity 9000

Yesterday, MediaTek officially announced its latest flagship processor, Dimensity 9000 SoC. From the specs of this chip, it is clear that this processor is ready for the flagship market. It now appears that MediaTek is ready to wrestle the flagship chip market with Qualcomm. According to a report on Sammobile, Samsung will test the MediaTek Dimensity 9000 flagship processor. @UniverseIce claims that MediaTek will send the Dimensity 9000 to all popular Android brands including Samsung. If the South Korean manufacturer finds the performance and power efficiency sufficient, it will use this chip in its flagship Galaxy smartphone or tablet.

Dimensity 9000

There are already confirmations that the Samsung Galaxy S22 will use the Snapdragon 8 Gen1 and Exynos 2200. Thus, Samsung might use the Dimensity 9000 in a high-end device in the second half of the year. The Dimensity 9000 will likely not launch on the Galaxy S22 series. However, we will likely see this chip in other flagship devices most likely tablets.

Samsung takes a fancy to the excellent power control performance of MediaTek Dimensity 9000. This chip uses TSMC’s 4nm process, which is better than Samsung’s own 4nm EUV manufacturing process. The power control performance of Snapdragon flagship processors has always been terrible. The Snapdragon 888 is a total mess when it comes to power control performance. It is most likely that Dimensity 9000 will lead the Snapdragon 8 Gen1 in terms of power control.

Samsung is currently the only mobile phone manufacturer that uses three flagship processors. The company will likely use Samsung Exynos 2200, Qualcomm Snapdragon 8 Gen1, and MediaTek Dimensity 9000. Most manufacturers will use Snapdragon 8 Gen1 and MediaTek Dimensity 9000. Samsung Exynos Flagship chips are mostly applied to their own Galaxy S series.

Read Also:  Samsung Exynos 2200 will come alongside S22 series; will fix all 2100 issues

Dimensity 9000 flagship processor

The Dimensity 9000 chip uses TSMC’s 4nm process + Armv9 architecture combination and has a high-performing Cortex-X2 super-large core. In addition, it has 3 Arm Cortex-A710 large cores (frequency 2.85GHz) and 4 Arm Cortex-A510 energy efficiency cores. This chip also supports LPDDR5X memory and the speed can reach 7500Mbps.

Dimensity 9000 adopts a flagship 18-bit HDR-ISP image signal processor. This technology can shoot HDR video with three cameras at the same time. Furthermore, the chip has a low power consumption performance. This chip comes with a high-performance ISP processing speed of up to 9 billion pixels/sec. It also supports triple exposure for triple cameras as well as up to 320MP cameras.

In terms of Al, Dimensity 9000 uses MediaTek’s fifth-generation Al processor APU. This is 4 times more energy-efficient than the previous generation. It can provide a high-efficiency AI experience for shooting, gaming, video, and other applications.

In terms of games, Dimensity 9000 uses Arm Mali-G710 graphics processor and launched a mobile ray tracing SDK kit. This includes Arm Mali-G710 ten-core GPU, mobile ray-tracing graphics rendering technology, support 180Hz FHD+ display.

In addition, this chip has a built-in M80 5G modem, which complies with the new generation of 3GPP R16 5G standards. It also supports Sub-6GHz 5G full-band network, which can greatly reduce communication power consumption while increasing network speed.

In terms of wireless network and audio technology, Dimensity9000 supports Wi-Fi and Bluetooth technologies with lower latency, including Bluetooth 5.3, Wi-Fi6E 2×2 MIMO, the upcoming Bluetooth LEAudio (dual-link true wireless stereo support) as well as the new Beidou III-B1C GNSS.

From the available reports, this flagship processor will be commercially available in Q1 next year.

Source/VIA :
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