Dimensity 7000 Preview: TSMC’s 5nm AnTuTu score exceeds SD870


Dimensity 7000

Recently, MediaTek held its annual executive summit where the company announced its latest flagship processor, Dimensity 9000. This processor breaks the limit of smartphone processors in the Android camp. This chip comes with at least ten world’s first including the world’s first 4nm processor. Furthermore, this flagship processor is also the first chip to exceed 1 million points on AnTuTu. In addition to this ultra-high-spec flagship processor, MediaTek has also prepared a sub-flagship processor to further consolidate MediaTek’s mid-range mobile phone SoC market. This chip is the Dimensity 7000 which should launch next year.

Dimensity 7000

According to popular Weibo tech blogger, @DCS, MediaTek will launch a sub-flagship processor that uses TSMC’s 5nm process next year. The engineering model of this processor has a running score of about 750,000 points. This means that the performance of this chip is better than the Snapdragon 870 but lower than the Snapdragon 888. The Snapdragon 870 is widely considered a flagship processor because it is above the mid-range class. However, this chip can be best described as a pseudo flagship processor. The industry expects a lot from the Dimensity 7000 since it claims to be better than the SD870.

Dimensity 7000 should bring a good power control

Using TSMC technology and the latest ARM architecture, we hope that the Dimensity 7000 can bring good power consumption control. According to reports, this 5nm processor will use the same 8-core architecture as Dimensity 9000. As of now, the details of this processor such as CPU and GPU are not available. However, if its AnTuTu score can hit 750k, then it must be at the flagship level in terms of performance.

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Past experiences show that MediaTek’s sub-flagship chips are generally for low-end models of around 2,000 yuan ($313). The positioning of the Dimensity 7000 should reduce the purchase threshold of high-performance mobile phones. There are also expectations that this chip will be a “new generation god chip” in the mid-to-high-end market.

Not long ago, Qualcomm released four low-end SoCs in one go, namely Snapdragon 778G Plus 5G, 695 5G, 480 Plus 5G, and 680 4G. These low-end SoCs will probably be available in the fourth quarter of this year at the earliest. Manufacturers such as Xiaomi, Redmi, and Oppo will be the first to use them. Qualcomm’s move was interpreted as to counter MediaTek and regain its status as the world’s number one mobile phone SoC manufacturer.

In response, the Dimensity 7000 processor launched by MediaTek will also be commercially available in the first quarter of next year. This will undoubtedly further consolidate its position in the low-end mobile phone SoC market.

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