Chinese manufacturer, Xiaomi, is getting set to unveil a new series, the Redmi K50 series. In preparation for the official launch of this series, the company has been teasing some specs of these devices. Recently, the company released a preheating poster that shows that the Redmi K50 series will be the first in the industry to support the new generation Bluetooth 5.3. The Bluetooth 5.3 supports lower latency, lower power consumption, and stronger anti-interference ability. This significantly increases the sound output quality and will be a favourite for gamers. Furthermore, Bluetooth 5.3 supportsĀ the new LC3 audio encoding.
However, the poster also reveals more than the Bluetooth 5.3. According to the poster, Bluetooth 5.3 needs to be used with LC3 headsets. This means that the company will have to launch relevant headsets that will support the Bluetooth specification. This new feature is one of the many firsts that the series will bring.
Redmi K50 series specifications
The Redmi K50 series will have four models. However, one of these models is already official and that is the Redmi K50 e-sports version. Thus, the upcoming launch event will have three models includingĀ Redmi K50, Redmi K50 Pro, and Redmi K50 Pro+. These smartphones come with different chips. They use the Snapdragon 870, Dimensity 8100, and Dimensity 9000 chips respectively.
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Of these chips, the MediaTek Dimensity 9000 is the strongest. Its performance is really strong, and its power consumption is worth looking forward to. This chip beats the Snapdragon 8 Gen 1 on GeekBench.Ā According to @DCS, the new Redmi K50 series, Dimensity 9000 version, currently has a single-core running score of 1310 and a multi-core running score of 4493. The Dimensity 8100 version currently has a single-core running score of 932 and a multi-core running score of 3690.
For comparison, the Snapdragon 888 scores 1129 for the single-core running point and 3538 for the multi-core running point. The Snapdragon 8 Gen 1 scoresĀ 1273 for single-core running points and 3809 for multi-core running points.
MediaTek Dimensity 9000 uses TSMC’s 4nm process + Armv9 architecture. It has one 3.05GHz Arm Cortex-X2 super core, three 2.85GHz Arm Cortex-A710 large cores, and four Arm Cortex -A510 small core.
A few days ago, Redmi officially announced that it will hold a new product launch conference at 19:00 on March 17. We expect the company to unveil the Redmi K50 series at this event. Judging from the warm-up posters, in addition to smartphones, Redmi will release new products such asĀ TVs, routers, and notebooks. Let’s wait and see what kind of surprises Redmi will bring at the press conference.
