At IFA ShowStoppers 2026 in Berlin,
TECNO expanded its hardware ecosystem beyond traditional budget-friendly smartphones. The brand’s showcase highlighted a clear pivot toward premium form factors, featuring convertible touch-enabled laptops, ultra-thin smartphones, and a bezel-less concept phone aimed at eliminating screen borders.
MEGABOOK Convertible Debut & Hardware Upgrades
Leading the laptop announcements was the MEGABOOK T15 360 Series (comprising standard and Pro models), marking TECNO’s entry into the 2-in-1 convertible space. Built with a CNC-machined aluminum chassis and a full 360° hinge, the series transitions between laptop, tablet, tent, and stand modes while supporting 10-point multitouch and MPP 2.0 active pens.
| MEGABOOK T15 360 (Standard) | MEGABOOK T15 360 Pro |
| 15.6" FHD Display (60Hz) | 15.6" 2.5K Display (120Hz) |
| 320 nits brightness | 350 nits, 100% sRGB |
| €899 – €999 | €1,099 |
Both T15 360 variants pack up to an Intel Core Ultra 9 185H paired with high-speed LPDDR5X RAM (up to 7467MHz) and PCIe M.2 2280 SSD storage (with a secondary slot on select SKUs). Power is delivered via a 70Wh battery charged via a compact 65W GaN adapter. The series lands in Europe in Q4 2026.
Additional MEGABOOK Form Factors
- MEGABOOK T17 Ultra: A desk-bound productivity machine featuring a 17.3-inch 16:9 panel, Core Ultra 9 silicon, a massive 99.99Wh battery (the maximum allowed on commercial flights), and 100W GaN fast charging.
- MEGABOOK K15S WCL: An entry-level machine targeting students and young professionals, powered by Intel’s budget-focused Wildcat Lake platform and a 16:10 display.
Smartphones & Engineering Concepts
TECNO brought a mix of conceptual hardware and imminent mass-market phones to Berlin. Including a live presentation of its
unique bezel-less smartphone with 0mm bezels.
Next-Gen Bezelless Concept Phone
Addressing the 1mm–2mm black borders found on current edge-to-edge displays, TECNO showcased a concept device claiming a true 0mm display border. The design re-engineers internal component stacking and panel packaging techniques to eliminate physical display margins.
POVA 8 Pro 5G Tonino Lamborghini Edition
Featuring aggressive, Italian supercar-inspired aesthetics, this special-edition POVA relies on a dual-chip architecture: a MediaTek Dimensity 7400 Ultimate 5G SoC working alongside a dedicated TECNO P1 Graphics Chip. Thermal management is handled by a 5K IceShield Vapor Chamber. Full spec availability and market release details follow on September 4.
Tecno CAMON Slim 5G
Designed around thin-and-light mobile photography, the CAMON Slim 5G crams a pro-grade imaging system and AI toolset into a chassis measuring just 6.39mm thin. Official release details drop on September 7.
TECNO’s presentation at IFA 2026 demonstrates an intent to compete directly in higher-margin hardware categories. While 0mm bezels remain in concept territory, bringing high-refresh 2.5K panels and Core Ultra 9 chips to a sub-€1,100 convertible laptop line positions the brand as a formidable disruptor against legacy PC vendors.