We’re now five days far from the launch of the so far awesome Find X. The recent week has seen some great leaks revealing many key features of the handset like Super VOOC, 5x lossless zoom, and very cutting edge specifications. What has eluded us so far is the real design, surprisingly. Well, today we get a glimpse of that or just one element of it.
Press invites of the Find X have started to hit their destinations and they come with a curious hint of the design. The envelope sheath of the invite has a rouned curved notch hinting that we’ll see a notch on the Find X unlike any other. Now, we’ve seen one particular leak point to such a design and what we’re now curious about is the bottom bezel. Maybe, the OLED panels will enable Oppo to make a true iPhone X clone, maybe not. The rear camera is believed to be 20MP + 16MP variety while the front has a single 25MP lens.
The entire spec-sheet of the Find X leaked yesterday revealing some hitherto known specs like the Snapdragon 845, 8GB of RAM, and 256GB of storage. It will most likely boast of a 6.4-inch 1080 x 2340 screen that is curved on the left and right edges and a 3,730mAh battery that will charge insanely fast.
This seems to be the second promising handset coming out of China this year that has us excited in terms of design at least. The Launch is on June 19.