The Meizu 16 and 16 Plus have been confirmed to launch on the 8th of August. They have recently received 3C certification meaning that they are now ready to be sold in the Chinese market. Both the models have been certified under the model numbers, M882Q (Meizu 16) and M892Q (Meizu 16 Plus).
The two flagships will be Meizu’s first phones with an 18:9 aspect ratio. The Chinese company’s CEO, Jack Wong has already revealed key details about the phone. We know that there’s a full-screen notch-less display, an in-display fingerprint scanner, Snapdragon 845, 6GB of RAM and a dual camera setup in tow. According to the CEO, only the Plus variant will carry the in-display fingerprint scanner. We had also reported earlier that it might support wireless charging. Since it might sport a glass back, wireless charging is a possibility.
Another hands-on image (see at the top) of the alleged Meizu 16 Plus has leaked confirming the presence of the vertically aligned dual cameras with a ring LED flash just below them on top of the glass back. The frame seems to be made of metal, likely aluminium. The image also confirms that a white variant of the flagship will be available. Jack Wong recently teased the pricing of the phone and claimed that it will be cheaper than the Xiaomi Mi8 and offer the same or even better performance.
The Meizu X8 is also expected to be unveiled alongside these two flagships. The X8, according to a leaked image will be a notched smartphone, the first notched phone by Meizu. It will be powered by the Snapdragon 710 chipset, the current favourite choice of affordable smartphones. Check out our post detailing what we know so far about the Meizu 16 here.