As we all know, the recent restrictions on Huawei in the United States are very serious. There are reports that many American companies will cut off Huawei’s supply. However, TSMC has clearly stated that it will not stop supplying to Huawei. Now, TSMC has officially announced that it has begun to mass produce the 7nm+EUV lithography and this will make TSMC’s progress far ahead of Intel and Samsung. According to reports, Huawei’s next-generation flagship processor, Kirin 985, will take the lead in adopting this technology.
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According to TSMC, the yield of the 7nm+EVU process on the production line has been raised to the same level as the original 7nm. The production capacity of the 7nm process chip will be significantly improved this year. It is estimated that the total capacity in 2019 will be equivalent to 12 million 300mm wafers, of which 1 million will be in the 7nm process, up from 150% last year.
It is worth noting that Kirin 985 is still a 4G baseband SoC at the chip level. To support 5G, it still needs to adopt the external Balong 5000 5G baseband. However, the next-generation SoC developed after Huawei Kirin 985 will directly integrate the 5G baseband, which is expected to come out early next year, and the supported frequency bands also cover high-frequency millimeter waves. It is reported that Huawei’s flagship processor, Kirin 985, will be the first to use the TSMC 7nm+EUV process, and the chip will be launched on the Huawei Mate 30 series.