MediaTek Dimensity 7000 Will Be Between Snapdragon 870 And 888

Dimensity 7000

Just recently, the Taiwanese MediaTek launched its new flagship SoC in face of the Dimensity 9000. But as you understand, there will be chips for lower categories as well. Among them, the first and the most anticipated model is going to be the MediaTek Dimensity 7000 mid-range chip. This will belong to an upper mid-range category and hit the market in 2022. In fact, there is no specific launch date, but the information comes our way from a well-known Weibo tipster. So the info we got should be reliable.

The source claims that the MediaTek Dimensity 7000 SoC has entered the testing phase. It ought to be using TSMC’s 5nm manufacturing process and using ARM’s new V9 architecture. Thus, the two key parameters of the forthcoming chip are identical to those found on the higher-end Dimensity 9000.

Dimensity 9000

However, there are still a few months left before the Dimensity 7000 hits the market. We mean it’s early to talk about clock speed and CPU configurations. But the same tipster proves the chip will comfortably slot in between the Snapdragon 870 and the Snapdragon 888 in terms of performance. If so, the Dimensity 7000 will appear in many smartphones.

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In order to understand what parameters it might come with, let’s recall the key features of the mentioned two Qualcomm chips.

Snapdragon 870 Parameters

The Qualcomm Snapdragon 870 integrates a fast ‘Prime Core’ that clocks up to 3.2 GHz and three additional ARM Cortex-A77 performance cores at up to 2.42 GHz. There are also four power-saving ARM Cortex-A55 cores with a clock speed of up to 1.8 GHz.

We are dealing with a 5G chip. So it’s expected to see the Qualcomm X55 5G modem with Sub-5 and mmWave support and global 5G bands with up to 7.5 GBit/s speed. At the same time, the chip supports WiFi 6 due to the SmartConnect 6800 modem. However, as for graphics, it still uses the Adreno 650, which offers a clock speed of 670 MHz.

There is a Hexagon 698 DSP, which is capable of providing KI performance of up to 15 TOPS. The Spectra 480 ISP supports 8K video recording and 200=megapixel photos.

The SoC is manufactured in a 7nm process.

Snapdragon 888 Parameters

When talking about the Qualcomm Snapdragon 888, we should understand that everything on this SoC is ideal. It is the most powerful chip in the Android camp. The SoC uses Samsung’s 5nm manufacturing node. The single “Prime Core” based on an ARM Cortex-X1 architecture has a clock speed of up to 2.84 GHz. Three A78 cores clocked at up to 2.42 GHz. Lastly, four energy-saving cores clocked at up to 1.8 GHz. As for connectivity, it supports the more advanced WiFi 6e network. For 5G, it integrates the Snapdragon X60 modem.

The Hexagon 780 DSP (up to 26 TOPS of AI performance) and a Spectra 580 ISP provide outstanding shooting performance.

Source/VIA :
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