Redmi smartphone with Dimensity 9000 & MIUI 13 appears online


The flagship and sub-flagship chips of MediaTek next year are Dimensity 9000 and Dimensity 7000 respectively. From the reports s far, Redmi will use both processors on a smartphone. In fact, there are reports that the company is already developing smartphones with these chips. Today, popular Weibo leakster, @DCS, claims that Redmi smartphones with MediaTek Dimensity 9000 and Dimensity 7000 will pre-install MIUI 13. The leakster did not reveal the specific models for these chips. However, the model that will use the Dimensity 9000 will most likely be the Redmi K50 series.

Dimensity 9000

While the Dimensity 9000 is a flagship processor with an AnTuTu score exceeding 1 million, Dimensity 7000 is a pseudo flagship processor with AnTuTu around 750,000 points. The Dimensity 7000 is better than the Snapdragon 870 but lower than Snapdragon 888 SoC.

Dimensity 9000 flagship processor

The Dimensity 9000 chip uses TSMC’s 4nm process + Armv9 architecture combination and has a high-performing Cortex-X2 super-large core. In addition, it has 3 Arm Cortex-A710 large cores (frequency 2.85GHz) and 4 Arm Cortex-A510 energy efficiency cores. This chip also supports LPDDR5X memory and the speed can reach 7500Mbps.

Dimensity 9000

Dimensity 9000 adopts a flagship 18-bit HDR-ISP image signal processor. This technology can shoot HDR video with three cameras at the same time. Furthermore, the chip has a low power consumption performance. This chip comes with a high-performance ISP processing speed of up to 9 billion pixels/sec. It also supports triple exposure for triple cameras as well as up to 320MP cameras.

In terms of Al, Dimensity 9000 uses MediaTek’s fifth-generation Al processor APU. This is 4 times more energy-efficient than the previous generation. It can provide a high-efficiency AI experience for shooting, gaming, video, and other applications.

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In terms of games, Dimensity 9000 uses Arm Mali-G710 graphics processor and launched a mobile ray tracing SDK kit. This includes Arm Mali-G710 ten-core GPU, mobile ray-tracing graphics rendering technology, support 180Hz FHD+ display.

In addition, this chip has a built-in M80 5G modem, which complies with the new generation of 3GPP R16 5G standards. It also supports Sub-6GHz 5G full-band network, which can greatly reduce communication power consumption while increasing network speed.

In terms of wireless network and audio technology, Dimensity9000 supports Wi-Fi and Bluetooth technologies with lower latency, including Bluetooth 5.3, Wi-Fi6E 2×2 MIMO, the upcoming Bluetooth LEAudio (dual-link true wireless stereo support) as well as the new Beidou III-B1C GNSS.

Dimensity 7000 should bring a good power control

Using TSMC technology and the latest ARM architecture, we hope that the Dimensity 7000 can bring good power consumption control. According to reports, this 5nm processor will use the same 8-core architecture as Dimensity 9000. As of now, the details of this processor such as CPU and GPU are not available. However, if its AnTuTu score can hit 750k, then it must be at the flagship level in terms of performance.

Source/VIA :
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