It may be hard for some to believe, but MediaTek is the market leader in mobile chips and pushed Qualcomm down to the second place. The Dimensity series of processors turned out to be very successful and the chip maker is actively developing it; offering the flagship SoC level within it – Dimensity 9000. We are also expecting the appearance of Dimensity 7000 in this family; and yesterday MediaTek announced that it plans to release Dimensity 8000.
The company does not provide any technical details, but Digital Chat Station comes to the rescue, which has repeatedly leaked reliable information. According to him, the Dimensity 8000 will be manufactured in accordance with the 5-nanometer process technology and the choice will fall on a two-cluster architecture. One block will be occupied by 4 high-performance Cortex-A78 cores, overclocked to 2.75 GHz, and the second cluster is reserved for a quartet of energy-efficient Cortex-A55 cores operating at 2.0 GHz.
The video accelerator Mali-G510 MC6 will be responsible for graphics processing. Smartphones based on Dimensity 8000 can be equipped with displays with a resolution of up to QuadHD + and a refresh rate of 120 Hz or crank up the frequency to 168 Hz, but with a FullHD + resolution. They promise support for LPDDR5 RAM and UFS 3.1 flash memory. There is no exact date when MediaTek will unveil the new chip. But the source claims that this will happen soon enough and the first presenters for the release of devices with it on board are Realme and Xiaomi.
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MediaTek strengthens its leading position in the smartphone chip market
Counterpoint Research has released a report on shipments of smartphone chipsets in the third quarter. The data showed that MediaTek widened its lead over Qualcomm, cementing its leading position in the market. Some success was also achieved by Unisoc, which overtook Samsung; taking the fourth place in the market of SoCs for smartphones.
MediaTek has managed to strengthen its position largely due to strong demand for 4G chips. Qualcomm continues to lead the 5G smartphone chipset market with 62% of its 5G cellular connectivity chips shipped. Apple managed to maintain its third place among mobile chip suppliers, while Samsung moved from fourth to fifth place; losing its position to Unisoc. The company has been able to achieve success by forging partnerships; with brands such as Realme, Motorola, ZTE, Samsung and Honor.
HiSilicon’s share has dropped significantly from 13% in the third quarter of last year to 2% this year. There is no doubt that the decline is due to US sanctions against Huawei; which have made it difficult for its subsidiary HiSilicon to manufacture cutting-edge chips.