Honor Magic Fold will pack the Snapdragon 8 Gen 1


Samsung has kept its domain over the segment of foldable smartphones for a long time. However, the competition is starting to appear with the likes of Xiaomi and Oppo joining the segment. Huawei is also there, but we can’t see the company making much damage to Samsung with all the problems it has… Anyway, the upcoming years should be quite important for the foldable segment with more and more brands joining the category. According to recent rumors, Honor is also gearing up to enter this particular category with no other device than the Honor Magic Fold. Today, a new report suggests that it will carry the excellent Snapdragon 8 Gen 1 which carves the device into the flagship segment.

Earlier this week, MediaTek issued a press release confirming some of the major smartphone makers that will use the Dimensity 9000 SoC. Now, Honor took to Weibo to assure its fans a smartphone will come with the flagship SoC. Now, a new report confirms the company’s foldable device with the Snapdragon 8 Gen 1. The details come from the very reputed Digital Chat Station. According to the reputed leakster, Honor’s upcoming flagship that will use the MediaTek Dimensity 9000 won’t be a foldable smartphone. However, the Foldable is still coming in the first months of 2022, and it will be powered by the Qualcomm Snapdragon 8 Gen 1 SoC.

Honor Magic 4 coming with Dimensity 9000, Honor Magic Fold with the Snapdragon 8 Gen 1

If the Honor Magic Fold appears in the first months of 2022, it may acquire certain advantages over other flagship devices. Samsung for example, shouldn’t update its lineup of foldable until August 2022. The Samsung Galaxy Z Flip4 and Z Fold4 are probably coming with the Snapdragon 8 Gen 1. Until then, the Honor Magic Fold will be one of the few foldable with Qualcomm’s latest flagship chipset. The recently released, Oppo Find N, for example, comes with the Qualcomm Snapdragon 888 SoC.

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Talking about the Dimensity 9000 SoC-powered smartphone, it shouldn’t lose much performance when compared to the Fold. This chipset is truly a flagship SoC built on the 4 nm process. Under the hood, it brings an ARM Cortex-X2 core clocked at 3.05 GHz and also is the first SoC to bring Bluetooth 5.3 standard. As per MediaTek, this chip is better than Apple’s A15 Bionic. However, it still falls behind Qualcomm when it comes to GPU performance.

Both the foldable and regular flagship smartphones should come under the Honor Magic series, perhaps the Honor Magic 4 series. With January 2022 just around the corner, we expect the leaks to intensify.

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