
The Snapdragon 8 Gen 2 is official! The new flagship SoC arrives with brute performance, Ray-Tracing, new AI tech, and Wi-Fi 7.

TSMC 5nm and 7nm processes are fully loaded until H2 2021. Apple, Qualcomm, Nvidia, and MediaTek are all battling for space

Samsung announced that it has mastered the 3D stacking process on 7nm EUV chips. It will save more power and take even less space.

AMD has just introduced new Ryzen 4000G APUs made on the 7nm process. The company also introduced new Athlon counterparts with Zen+ standard.

TSMC will have a shareholders' meeting tomorrow, and discuss two main topics of the impact of Huawei's ban and the establishment of factories in the US.

According to a report from Digitimes, NVIDIA and AMD have bought up all excess capacity at TSMC. Both companies will join the 7nm chip market in H2 2020.

According to a leak, Huawei's next mid-range chipset dubbed Kirin 820 5G will be made on a 7nm process and will come with the brand new Mali-G77 GPU.

TSMC 7nm + EUV process will be mass-produced in June. The Kirin 985 will be the first to use this process followed by Apple A13

Huawei has also started developing the Kirin 990, which is assumed to use the second-gen TSMC's 7nm process (N7 Plus) EUV lithography.

The Realme U1 was the first smartphone released with MediaTek's Helio P70, and according to a mysterious AI benchmark test, there's another device coming with the Helio P80. Today, the Taiwanese chips...
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