That bezel-free Oppo phone we have seen so often over the past weeks has appeared once again showing the back panel in a render.
It seems Oppo are continuing down the path of making a phone as thin as possible as can be seen in the render of the alloy bodied phone. According to the source where the image was originally found, the R7 could be as thin as 4.85mm!
Specifications seem a little on the budget side of things for this carefully crafted device and include a 64bit Mediatek MT6735 chipset, a quad-core chip with Mediatek’s claimed “world mode 4G LTE”. Despite the entry-level chipset we doubt the R7 will be an affordable phone and we could be looking at over 2000 Yuan once launched.
The render shows us that a SIM/SD tray is located in the base of the phone, but our concern is the headphone jack which might once again be removed due to the thin body (see Oppo R5)