Rumors started to spread in the beginning of March talking about the arrival of a new mid-range SoC to succeed the last year’s Kirin 810. This new chipset would give power to the Honor 30S smartphone featuring an integrated 5G modem. Today, the company revealed the highly-anticipated smartphone and it indeed comes with the all-new HiSilicon Kirin 820 5G chipset.
Kirin 820 5G specifications
Huawei’s brand new platform comes as the company’s solution to equip its mid-range devices with 5G connectivity. It’s an incremental upgrade over the last year’s Kirin 810 with a newer GPU. The new platform uses a 7nm process and features 4x ARM Cortex-A76 BIG cores and 4x ARM Cortex-A55 little cores. The new chipset has a single A76 core clocked at 2.36GHz, while the other three are clocked at 2.22GHz. The company promises, at least, 27% more power efficiency in this new chip if we compare it with the older chip.
The new SoC makes use of a Mali-G57 Hexa-Core GPU which is slightly better than the Mali-G52 found on Kirin 810. Huawei also implemented GPU Turbo and Kirin Gaming+ 2.0 technology on this chipset for improved gaming performance. The new chip boasts the usual set of AI technologies thanks to the new NPU unit. According to the company, the new AI is 73% better than what we could achieve with the Kirin 810.
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The Kirin 820 includes ISP 5.0 and BM3D SLR which ensures a greatly improved noise reduction in pictures. Moreover, there’s a technology ensuring video dual-domain noise reduction. Last but not least, the new chip also ensures 4K video capture at 60FPS. The chipset 5G technologies are ensured by the company’s Balong 5000 5G modem. That’s the very same modem used in the Kirin 990.
The new chipset is present in the Honor 30S, but we believe that it will be present in many more devices from Huawei and Honor in the coming months.
