Huawei might be getting to grips with the entry and mid-range phone markets, and will soon be making strides in to the flagship field against fierce competition!
We have seen evidence of a new Huawei smartphone in the form of Antutu benchmarks in the past. Those benchmarks showed us that their next premier phone would boast a Kirin 920 chip, an SoC is on par with Qualcomm’s Snapdragon 801 and 805 offerings.
Benchmarks are one thing, but physical evidence is what we really like to see, and today we got it. The above rear panel is rumoured to be from a new Huawei phone that will have an all alloy body and receive features like a fingerprint scanner. The engineer who leaked the original image on Weibo insists the new phone will be a true smartphone with a very high price tag to match.
For Huawei to make it in the big leagues they are going to need to offer hardcore Android phone users a device with hardware similar to the Vivo Xplay 3S and Oppo Find 7 i.e a 2K screen option, 3GB RAM and advanced camera hardware. Even with such a device though, would you be willing to shell out a wad of cash for a phone with the Huawei logo?