The next-gen flagship smartphone of Huawei’s sub-brand has been buzzing on the net for a while. Today, we learned much about the upcoming Honor 30s as the manufacturer released a poster. The latter not only reveals its launch date but also shows some design elements.
From this page, we can see that Honor is officially expected to hold the Honor 30s online conference on March 30. One of the most interesting features it will come with is going to be the new Kirin 820 5G chip.
As for specific parameters, the Kirin 820 SoC will be a 7nm chip with Cortex-A76 cores acting as big cores. Essentially in the same way as the Kirin 810 and 990 4G. The ISP and NPU are “fully upgraded”, presumably compared to the 810 SoC. Interestingly enough, this will be the first chipset to come out of the HiSilicon foundries featuring Mali-G77 GPU. Even the Kirin 990 uses Mali-G76 which is now outdated. According to ARM, the G77 is 120% to 140% faster per mm2 compared to the G76, it’s 30% more energy-efficient as well.
However, in addition to the Kirin 820 5G chip, the Honor 30s is also expected to use a side fingerprint recognition solution + matrix-like rear quad-camera solution. We also know there will be at least two color variants, including the gradient white and orange color options. Plus, this handset will come with a 40W power adapter.
Honor Mobile said that this will be a milestone product that will allow more users to experience the leading technology in the 5G era.