TSMC’s 5nm chips like the Bionic A14 and Kirin 1020 are already on their way. The company is already getting set for the trial production of its 3nm process. However, for the first time, we have now heard of the TSMC 2nm solution. According to recent reports, TSMC’s annual report mentioned the company’s 2nm manufacturing process for the first time.
TSMC’s annual report did not detail the 2nm process technology
In TSMC’s annual report (2018), it stated that the company’s 3nm technology is in a comprehensive development stage. In the 2019 annual report, TSMC said the company has begun to develop the 2nm technology. It believes that this manufacturing process will lead the semiconductor industry. The company is also exploring technologies below 2nm. However, this is about all that the report says about TSMC’s 2nm process.
According to TSMC, its focus last year was on the research and development of lithography technology. The company uses this solution in its 5nm technology, 3nm process development and it is still using it in preparation for technologies below 2nm. The 5nm development is complete and the company only needs to deliver its orders.
For the development of 3nm technology, extreme ultraviolet light (EUV) lithography technology exhibits excellent optical capabilities and wafer yields that meet expectations. TSMC’s R & D unit is working on the extreme ultraviolet technology to reduce the exposure mask defects and process stacking errors of the exposure machine. This will also reduce the overall cost. This year, TSMC will focus on improving the quality and cost of EUV technology in 2nm and more advanced processes.
TSMC is the world’s largest foundry semiconductor manufacturing plant, with customers including Huawei, Apple, and Qualcomm. Its headquarters is in the Hsinchu Science Industrial Park in Hsinchu, Taiwan. TSMC shares are available on the Taiwan Stock Exchange under the stock code 2330. Furthermore, the New York Stock Exchange lists its American Depository Receipts under the ticker symbol TSM.