A few hours ago, we reported that Xiaomi might have started work on two smartphones tipped to be powered by the upcoming Qualcomm Snapdragon 670. Based on an educational guess, we assumed one of the devices might be the Mi Max 3, and now, Images of an alleged third-party protective TPUĀ case purportedly belonging to the Mi Max 3 have surfaced on the web revealing its design features.
The leaked renders, if based on the real thing, reveals that the Xiaomi Mi Max 3 will feature a circular fingerprint sensor, as well as a vertical dual-camera setup on the back. The renders further reveal that the Xiaomi Mi Max 3 will retain the headphone jack and the IR Blaster as indicated by two of the three cutoutsĀ on top, while the need for the third cutout is yet to ascertain. The USB Port, Microphone and the Speaker grill are located at the bottom, while cutouts for what might be the power button and volume rocker are seen on one side of the device.
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We currently do not know what the upcoming Xiaomi Mi Max 3 will bring to bear, but there are talks that the device be powered by the Snapdragon 670 SoC. Xiaomi might also adopt the trendy 18:9 aspect ratio, but will retain its phablet status and could come with a display size as large asĀ 6.99-inches.
We’re not exactly sure when to expect the Xiaomi Mi Max 3, but that could happen as early as May 2018 if Xiaomi sticks to its tradition.Ā This is only but a leaked render, so we advise against blindly trusting it until it is officially confirm.
The hole for the cameras seems to wide… Considering a 7″ display, the hole should be much narrower. The render seems not so accurate.
On the same side of power and volume buttons, toward the bottom, there is written something in the image… what is it?